Amkor Technology is strengthening its position in advanced chip packaging. Vertiv is capitalizing on soaring demand for liquid cooling and power infrastructure. Both offer investors a unique way to ...

BE Semiconductor Industries is a key player in die-attach and packaging equipment, critical for advanced chip manufacturing. BESIY benefits from AI-driven chip demand and leads in advanced die attach ...

Rapidus plans to outline its early-stage work on panel-level packaging using 600 × 600 mm glass substrates at SEMICON Japan, ...

According to South Korean technology outlet , SK hynix is reviewing plans to build its first 2.5D advanced packaging mass production line in the US, a move that would deepen the South Korean memory ...

China’s push to build its own high‑end AI accelerators has moved from aspiration to measurable silicon, and the obvious ...

Apple has initiated early-stage discussions with select Indian semiconductor companies to explore the assembly and packaging of iPhone components, marking a potential milestone in India’s growing role ...

The rising costs of AI chips driven by advanced process technologies have continued to escalate, while the direct performance gains from these process improvements have significantly diminished.

In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the ...

A new Tata–Intel partnership signals India’s growing role in global chip and AI PC manufacturing India’s long-stated ambition to become a global semiconductor hub is moving decisively from policy to ...

Average Al chip-package size to triple by 2030 for more memory and computing cores Advanced packaging is becoming a core driver of semiconductor performance and profitability as artificial ...

Global semiconductor foundry revenue rose about 17% year over year to roughly $84.8 billion in the third quarter of 2025, supported by strong demand for artificial intelligence chips built on advanced ...