A new technical paper titled “Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects” was published by researchers at Siemens EDA, D2S, and Univ.

There’s been a boom in merger and acquisition (M&A) activity in the fire and security world over the last decade. Fire protection and security as an industry has proven to be largely recession-proof ...

"Why would anyone be afraid of a book? There are guns and snakes and all kinds of other stuff for sale that could actually kill you." Why are people afraid of books? Mac asks this very question in ...